TSMC 3D IC packaging tech

TSMC Reportedly Mulls Superior Chip Packaging Facility in Arizona

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TSMC is in talks with Arizona officers to construct its chip packaging facility within the state, Katie Hobbs, governor of Arizona, stated in Taipei after visiting the world’s No.1 foundry’s headquarters, studies Bloomberg. If the plan involves fruition, then TSMC’s could have a vertically built-in chip manufacturing chain within the USA for the primary time ever.

TSMC has constructed Fab 21 in Arizona and is presently putting in manufacturing instruments there. The corporate can also be build up the second section of the fab and has authorised plans to speculate $40 billion in these two manufacturing services. However the firm apparently doesn’t wish to cease there and is discussing the potential of constructing a complicated packaging fab within the state, too, as this may assist it to assemble advanced system-in-packages for its purchasers from the U.S. on American soil.

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