Intel Will Undertake 3D Stacked Cache for CPUs, Says CEO Pat Gelsinger

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Intel CEO Pat Gelsinger held a Q&A session with the press right here at Innovation 2023, and in response to a query about whether or not Intel would undertake a 3D cache strategy like AMD does with its 3D V-Cache processors, he confirmed that, whereas Intel will take a little bit of a unique strategy, it is going to additionally use stacked cache reminiscence paired with the CPU die. This expertise will not arrive with Meteor Lake, however it’s in growth for a variety of various Intel processors sooner or later. Intel can even make the cache-stacking expertise obtainable to its IFS clients, similar to TSMC allows AMD’s 3D V-Cache with its hybrid bonding packaging tech. 

In response as to if or not Intel will undertake a 3D V-Cache expertise, Gelsinger mentioned, “If you reference V-Cache, you are speaking a few very particular expertise that TSMC does with a few of its clients as effectively. Clearly, we’re doing that in a different way in our composition, proper? And that individual kind of expertise is not one thing that is a part of Meteor Lake, however in our roadmap, you are seeing the concept of 3D silicon the place we’ll have cache on one die, and we’ll have CPU compute on the stacked die on high of it, and clearly utilizing EMIB that Foveros we’ll be capable of compose totally different capabilities.”

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