TSMC 3D IC packaging tech

Veteran TSMC R&D Exec Joins Samsung’s Chip Packaging Workforce

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A high-ranking R&D govt with practically twenty years of expertise at TSMC lately took up a place with Samsung. Semiconductor trade insiders talking with Taiwan’s DigiTimes described the senior govt’s transfer as “uncommon” and one that could be a “menace” to TSMC’s hegemony.

Lin Jun-Cheng began his lengthy tenure at TSMC in 1999 after serving at Micron Expertise. The exec labored in TSMC’s superior packaging and testing division and has been described as a driving drive in advancing packaging applied sciences like CoWoS and InFO. Earlier than leaving TSMC in 2017, Lin was the Deputy Director of the R&D division. Within the interim, he labored because the CEO of Skytech, a semiconductor tools firm in Taiwan, accumulating manufacturing expertise for packaging tools. His new place at Samsung is because the VP of Superior Packaging Enterprise. 

(Picture credit score: TSMC)

Experiences counsel Lin’s time at TSMC didn’t present the chance to deal with purchasers straight. Maybe he received far more of that sort of expertise in his most up-to-date stewardship of Skytech. Nonetheless, his TSMC work in 3D IC packaging was extremely well-liked with necessary foundry purchasers like Nvidia, Apple, AMD, and varied HPC specialist corporations. As well as, throughout his TSMC R&D profession, Lin helped the agency safe greater than 400 patents.

(Picture credit score: TSMC)

It’s value wanting extra intently at Lin’s most up-to-date experiences at Skytech. The corporate truly makes foundry instruments for supporting 2.5D and 3D packaging. Lin has helped Skytech safe over 100 patents.

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