Ryzen 7000 IOD

AMD Shares New Second-Gen 3D V-Cache Chiplet Particulars, as much as 2.5 TB/s

Posted on

(Picture credit score: @Locuza_ Twitter)

AMD’s Ryzen 9 7950X3D is the quickest gaming CPU on the earth because of AMD’s resolution to convey its disruptive 3D chip-stacking tech to Zen 4, however curiously, the corporate didn’t share any particulars about its new Second-Gen 3D V-Cache in its Ryzen 7000X3D briefing supplies. We initially discovered some particulars at a current tech convention that we included in our evaluation, and now AMD has lastly answered a couple of of our follow-up questions and shared essential new particulars, together with that the chiplet stays on the 7nm course of and now has a peak bandwidth of as much as 2.5 TB/s, whereas the first-gen 3D V-Cache peaked at 2 TB/s (amongst a number of different new information). We even have new pics and diagrams of the brand new 6nm I/O Die that AMD makes use of for its Ryzen 7000 processors.

Intel does not have a solution for this tech but, assuring AMD a win in each gaming efficiency and sure knowledge heart purposes. Total, AMD’s second-gen 3D V-Cache know-how is a formidable step ahead over the first-gen as a result of it permits the corporate to leverage the now-mature and less-expensive 7nm course of node to spice up the efficiency of its cutting-edge 5nm compute die. The brand new design represents AMD taking the important thing benefit of chiplet-based design methodologies — utilizing an older and less-expensive course of node in tandem with costly new course of tech — into the third dimension.  Now for the nitty-gritty particulars.

First, a fast high-level refresher. As you’ll be able to see above, AMD’s 3D V-Cache tech stacks a further L3 SRAM chiplet instantly within the heart of the compute die (CCD) chiplet to isolate it from the heat-generating cores. This cache boosts capability to 96MB for the 3D V-Cache-equipped chiplet, thus boosting efficiency for latency-sensitive apps, like gaming.

We acquired new data on the second-gen implementation each direct from AMD and from the 2023 Worldwide Stable-State Circuits Convention (ISSCC), the place AMD made a presentation on the Zen 4 structure.

AMD’s previous-gen 3D V-Cache used a 7nm L3 SRAM chiplet stacked atop a 7nm Zen 3 CCD. AMD caught with the 7nm course of for the brand new L3 SRAM chiplet however now stacks it on prime of a smaller 5nm Zen 4 CCD (see the desk beneath). This creates a measurement mismatch, although, which required a couple of alterations.

Swipe to scroll horizontally
Second-Gen 3D V-Cache Expertise AMD Ryzen 9 7950X3D
Row 0 – Cell 0 2nd-Gen 7nm 3D V-Cache Die First-Gen 7nm 3D V-Cache Die 5nm Zen 4 Core Complicated Die (CCD) 7nm Zen 3 Core Complicated Die (CCD)
Dimension 36mm^2 41mm^2 66.3 mm^2 80.7mm^2
Transistor Rely ~4.7 Billion 4.7 Billion 6.57 Billion 4.15 Billion
MTr/mm^2 (Transistor Density) ~130.6 Million ~114.6 Million ~99 Million ~51.4 Million

Supply hyperlink

Leave a Reply

Your email address will not be published. Required fields are marked *