YMTC has begun shipments of its Zhitai TiPlus7100 SSDs primarily based on its newest 232-layer 3D NAND Xtacking 3.0 reminiscence with a 2400 MT/s interface, ITHome studies. This confirms that YMTC’s newest 3D NAND reminiscence — which is required to provide SSDs with a PCIe 5.0 x4 interface that absolutely saturate this interface and hit a 12.4 GB/s sequential learn pace — is now in mass manufacturing.
YMTC’s Zhitai TiPlus7100 are M.2-2280 PCIe 4.0 x4 drives designed to mix affordability with sturdy efficiency. The SSDs are to be obtainable in 512GB, 1TB, and 2TB variations with the speediest rated for a sequential learn pace of as much as 7000 MB/s in addition to a sequential write pace of as much as 6000 MB/s.
Relating to random efficiency, then 1TB and 2TB fashions are set to supply as much as 900K random learn IOPS in addition to as much as 700K random write IOPS. The TiPlus7100 drives don’t carry any SDRAM buffer and makes use of a bunch reminiscence buffer, which is an indicator that we’re coping with a fairly priced product. In the meantime, these drives can simply problem the finest SSDs obtainable as we speak.
|Interface||PCIe 4.0 x4, NVMe 1.4||PCIe 4.0 x4, NVMe 1.4||PCIe 4.0 x4, NVMe 1.4|
|Sequential Learn Velocity||7000 MB/s||7000 MB/s||7000 MB/s|
|Sequential Write Velocity||3600 MB/s||6000 MB/s||6000 MB/s|
|Random Learn (4K)||800K IOPS||900K IOPS||900K IOPS|
|Random Write (4K)||600K IOPS||700K IOPS||700K IOPS|
|MTBF||1.5M hours||1.5M hours||1.5M hours|
|Sturdiness||300 TBW||600 TBW||1200 TBW|
|Guarantee||5 years||5 years||5 years|
YMTC doesn’t disclose what controller it makes use of for its Zhitai TiPlus7100 SSDs, however the principle level about these drives for us is that they use the corporate’s 1Tb X3-9070 chips — 232-layer six-plane 3D TLC NAND reminiscence units with a 2400 MT/s interface and the corporate’s proprietary Xtacking 3.0 structure.
The 1Tb X3-9070 gadget not solely boasts a bit density of 15.03 Gb/mm^2 (as revealed by TechInsights), which by far exceeds the bit density of 1Tb 3D TLC NAND reminiscence ICs with lower than 200 layers, nevertheless it additionally options an ultra-fast 2400 MT/s interface.
Earlier this week, Micron launched its Micron 2550 drives primarily based on its 232-layer six-plane 3D TLC NAND units that’s mentioned to have a 14.6 Gb/mm^2 bit density, which outstrips YMTC’s 232-layer 3D TLC ICs by way of bit density. In the meantime, Micron’s ICs presently shipped have a 1600 MT/s interface, which is nice sufficient for mainstream drives, however not adequate for ultra-high-performance SSDs with a PCIe 5.0 x4 interface.
|Row 0 – Cell 0||YMTC||Micron||Samsung||WD/Kioxia||SK hynix||YMTC|
|Density per sq. mm||15.03 Gb mm^2||14.6 Gb mm^2||6.91 Gb mm^2||10.4 Gb mm^2||10.8 Gb mm^2||8.48 Gb mm^2|
|Die Capability||1 Tb||1 Tb||512 Gb||1 Tb||512 Gb||512 Gb|
|Subsequent-Gen (launch date)||?||?||3xx (unknown)||212 (unknown)||238-Layer (2023)||196-Layer (2H, 2022)|
Subsequently, whereas YMTC shouldn’t be the one firm to mass produce 3D NAND with over 200 layers, it’s the first firm that’s mass-producing reminiscence with a 2400 MT/s I/O. This isn’t going to final lengthy although as Micron plans in provoke manufacturing of 232-layer 3D NAND with a 2400 MT/s interface in early 2023.