Lisa Su, AMD’s chief govt, and different firm C-level execs plan to go to Taiwan in late September – early November to debate collaboration with native companions. Among the many corporations, AMD’s administration intends to fulfill are Taiwan Semiconductor Manufacturing Co., chip packaging specialists, and large PC makers.
Lisa Su plans to debate future collaboration with TSMC’s chief govt CC Wei throughout her go to. Among the many matters is the utilization of TSMC’s ‘N3 Plus’ fabrication node (in all probability N3P) and N2 (2nm-class) manufacturing know-how, experiences DigiTimes (opens in new tab) citing sources with data of the matter. As well as, the 2 corporations’ chief executives will focus on plans for upcoming orders, which embrace applied sciences which are both obtainable or set to turn out to be obtainable within the short-term future.
AMD’s spectacular success in recent times is enabled primarily by TSMC’s means to provide chips in excessive quantity utilizing its extremely aggressive course of applied sciences. To proceed its spree of screaming success, AMD should guarantee enough allocation at TSMC and early entry to the foundry’s newest course of design kits (PDK). TSMC will begin quantity manufacturing of chips on its N2 node someday within the second half of 2025, so it’s about time for AMD to begin speaking concerning the utilization of N2 for its 2026 merchandise and past.
Along with superior TSMC’s semiconductor manufacturing applied sciences, AMD’s future success will rely on superior chip packaging applied sciences as the corporate (like different designers of chips) will extensively use multi-chiplet chip packaging applied sciences.
So, AMD’s Lisa Su may also focus on collaboration with TSMC, Ase Know-how, and SPIL on the superior packaging entrance. At current, AMD already makes use of TSMC’s 3D SoIC (system on built-in chips) platform, comparable to CoWoS (chip on wafer on the substrate) packaging know-how, in addition to Ase’s fan-out embedded bridge (FO-EB) packaging methodology for a few of its merchandise, in accordance with DigiTimes (opens in new tab). Nevertheless, sooner or later, utilization of progressive packaging will solely enhance, which is why AMD wants to barter allocation and costs nicely upfront.
Along with longer-term plans, AMD’s C-level executives will focus on extra down-to-earth issues like provides of refined printed circuit boards (PCBs) used for its CPUs (which is likely one of the components that restrains AMD server CPU shipments) in addition to provisions of Ajinomoto build-up movies (ABF) for these PCBs with companions like Unimicron Know-how, Nan Ya PCB and Kinsus Interconnect Know-how.
Lastly, AMD’s executives will meet with Asus and Acer, two massive PC makers from Taiwan with shut ties with the American chip designers, and ASMedia, which develops chipsets for the crimson firm.