Micron Announces 232-Layer 3D NAND Flash

Micron Broadcasts 232-Layer 3D NAND Flash

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Micron on Thursday introduced the trade’s first 3D NAND reminiscence system that includes 232 layers. The corporate plans to make use of its new 232-layer 3D NAND merchandise for quite a lot of merchandise, together with solid-state drives and plans to begin ramping up manufacturing of such chips typically in late 2022. 

Micron’s 232-layer 3D NAND system contains a 3D TLC structure and has a uncooked capability of 1Tb (128GB). The chip is predicated round Micron’s CMOS beneath array (CuA) structure and makes use of NAND string stacking method to construct two arrays of 3D NAND on prime of one another. 

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